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PAN MALAYSIA ELECTRO PLATING SDN BHD

Copper Plating

Copper Symbol_page-0001

Copper has excellent conductive properties and therefore make it suitable for use with electrical components. When used as a base coat for nickel steel plating, electroplated copper provides superior protection against corrosion in comparison to other materials. 

 

Copper is often used as a base coat for other plated layers due to it’s good adhesion properties. 

 

Copper plating is widely used in electrical, electronics and semi conductor industries over a wide range of products. We ensure the highest quality results by plating copper in accordance with MIL-C-14550 and ASTM-B-734.

Copper Plating Specification
MIL-C-14550

Copper Plating ServicesType of Copper Plating bath is not specified. Classes of copper plating services as follows:

Class 0 – 0.001-0.005 inches minimum deposit thickness
Class 1 – 0.001 inch minimum deposit thickness
Class 2 – 0.0005 inch minimum deposit thickness
Class 3 – 0.0002 inch minimum deposit thickness
Class 4 – 0.0001 inch minimum deposit thickness

Intended Uses per Section 6.1 of MIL-C-14550
Class 0 – for heat treatment stop-off shield
Class 1 – for carburizing shield, decarburizing shield and printed circuit board plated through holes or as specified on the engineering drawing.
Class 2 – for undercoating for nickel and other metals
Class 3 – to prevent basis metal migration into tin layer to poison solderability
Class 4 – 0.0001 inch same as 0.0002 inch

ASTM B734
Copper Plating ServicesType of Copper Plating bath is not specified. Classes of copper plating services as follows:

Class 25 – 25um minimum coating thickness
Class 20 – 20um minimum coating thickness
Class 12 – 12um minimum coating thickness
Class 5 – 5um minimum coating thickness
Class x – Thickness as specified [um]

AMS 2418
Type 1 (Engineering Plating) Shall designate a thickness of 0.0005″ to 0.0007″
Type 2 (Plating for Masking) shall be nominally 0.002″ with no area having a plate thickness of less than 0.0007″
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